PCB Material Specification: CEM-3 Paper and Woven Fiberglass
| Physical Properties | Values | Units |
| Resin / Base | Epoxy | - |
| Color | Green | - |
| Fungus Resistance | Excellent | - |
| Solvent Resistant | Excellent | - |
| Specific Gravity | 1.65 | - |
| Transparency | Fair | - |
| Water Absorption | 0.10 | % |
| Mechanical Properties | Values | Units |
| Compressive Strength | - | PSI x 10^3 |
| Flexural Strength - Length | 55 | PSI x 10^3 |
| Flexural Strength - Cross | 45 | PSI x 10^3 |
| Flexural Modulus - Length | 2.4 | PSI x 10^6 |
| Flexural Modulus - Cross | 2.0 | PSI x 10^6 |
| Izod Impact - Length | 3.1 | Ft. lbs/In. notch |
| Laminate Bond Strength | N/A | Lbs |
| Punching Temperature | 75 | °F |
| Rockwell Hardness | 105 | M Scale |
| Electrical Properties | Values | Units |
| Capacitance Drift | Excellent | - |
| Dielectric Constant 1 MHz | 4.0 | D24/23 |
| Dissipation Factor 1 MHz | .022 | D24/23 |
| Dielectric Breakdown (Para) | 66 | KV |
| Dielectric Strength (Perp) | 550 | V/MIL |
| Resistivity Surface | 10 | Megohms x 10^4 |
| Insulation Resistance (EIA Pattern) | 4.0 | Megohms x 10^6 |
| Thermal Properties | Values | Units |
| Glass Transition | 120 | °C |
| Thermal Conductivity | 1.8 | (5) |
| Coefficient of Expansion - Length | 1.0 | In./In./C x 10^-5 |
| Coefficient of Expansion - Cross | 1.5 | In./In./C x 10^-5 |
| Underwriter Lab Rating | Values | Units |
| Flammability | 94V-0 | - |
| High Ampere Arc | 200 | Cycles |
| High Voltage Tracking | 11.3 | In./Min |
| Soldering Limits - 500F | N/A | Seconds |
| Soldering Limits - 525F | 30 | Seconds |
| Maximum Operating Temperature | 130 | °C |
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